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Amphenol Communications Solutions |
Part No. |
L717HDC62POL2C309
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Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 62 Pin, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L717TSA15POL2C309
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Description |
Dsub, Stamped Signal 3A, Straight PCB Thru Hole Low Profile, Height=6.02mm(0.237in), 15 Pin, Bright Tin Shell+Grounding Dimples, 0.76m(30 in) Gold, 3.05mm (0.120in) Clear Hole
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L717HDAH26POL2C309
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Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Pin, 0.76m (30 in) Gold, 4-40 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L77TSC37SOL2C309
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Description |
Dsub, Stamped Signal 3A, Straight PCB Thru Hole Low Profile, Height=6.02mm(0.237in), 37 Socket, Bright Tin Shell, 0.76m(30 in) Gold, 3.05mm (0.120in) Clear Hole
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L77TSCH37SOL2C309
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Description |
Dsub, Stamped Signal 3A, Straight PCB Thru Hole Low Profile, Height=6.02mm (.237in), 37 Socket, Bright Tin Shell, 0.76um (30u\\) Gold, 4-40 Threaded Rear Insert
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L77HDC62SOL2C309
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Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 62 Socket, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L77HDBH44SOL2C309
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Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 44 Socket, 0.76m (30 in) Gold, 4-40 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L77HDBG44SOL2C309
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Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 44 Socket, 0.76m (30 in) Gold, M3 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L717HDEH15POL2C309
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Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 15 Pin, 0.76m (30 in) Gold, 4-40 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L717HDD78POL2C309
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Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 78 Pin, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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