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Renesas
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| Part No. |
HVU307
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| OCR Text |
...ishap. notes regarding these materials 1. these materials are intended as a reference to assist our customers in the selection of the renesas technology corporation product best suited to the customer's application; they do not convey... |
| Description |
Diodes>Variable Capacitance
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| File Size |
73.42K /
7 Page |
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it Online |
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TI store
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| Part No. |
JM38510/31003BDA
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| OCR Text |
...y weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this co... |
| Description |
<font color=red>[Old version datasheet]</font> DUAL 4-INPUT POSITIVE-AND GATES
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| File Size |
838.67K /
16 Page |
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it Online |
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STANLEY ELECTRIC CO.,LT...
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| Part No. |
HFTV1108GS-TR
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| OCR Text |
...er types of friction with hard materials . 3. recommended temperature profile for the reflow soldering is listed as the temperature of the resin surface. temperature distribution varies on heating method, pcb material, other compon... |
| Description |
Wide temperature range
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| File Size |
713.98K /
24 Page |
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it Online |
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M/A-COM Technology Solu...
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| Part No. |
1N4454
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| OCR Text |
...nc ("macom") products. these materials are provided by macom as a service to its customers and may be used for informational purposes only. except as provided in macom's terms and conditions of sale for such p... |
| Description |
Metallurgically Bonded
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| File Size |
536.41K /
3 Page |
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it Online |
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