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Amphenol Communications Solutions |
| Part No. |
93992-422HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 22 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
93992-414HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 14 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
89099-243LF
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| Description |
Metral® Power , Backplane Connector, Power Header, 5 Row ,Vertical Press-Fit, Wide body
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
93992-401HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 1 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
93992-434HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 34 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
93992-425HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 25 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
93992-428HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 28 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
93992-431HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 31 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Harwin PLC HARWIN INC
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| Part No. |
D9224-46 D9924-46 D9224-01 D9724-46 D9240-46 D9922-46
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| Description |
2.54mm Pitch Dual Row Vertical Through Connect Header Assembly, tin (hi-temp mould), 24-way DIP24, IC SOCKET 2.54mm Pitch Dual Row Vertical Through Connect Header Assembly, tin, 24-way DIP24, IC SOCKET 2.54mm Pitch Dual Row Vertical Through Connect Header Assembly, tin (hi-temp mould), 40-way DIP40, IC SOCKET DIP22, IC SOCKET
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| File Size |
238.38K /
1 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
93992-423HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 23 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
93992-410HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 10 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Price and Availability
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