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  NP171-22501-G4-BF Datasheet PDF File

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Part No. NP171-22501-G4-BF
Description PGA225, IC SOCKET

File Size 135.54K  /  2 Page

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Amphenol Communications Solutions

Part No. 10127225-122501ULF
Description ExaMEZZ® 56Gb/s High Speed Mezzanine Connector System, Hermaphroditic, Vertical, Press-Fit, 2 Pair, 19 Column, 152 Position, 22.50mm Stack Height, 2.00mm (0.079in) Column Pitch
Tech specs    

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HUA FENG CIRCUIT





   
Part No. NP171-16904MF-G4-BF-P NP171-22501MF-G4-BF
Description PGA169, IC SOCKET
PGA225, IC SOCKET

File Size 127.30K  /  2 Page

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Part No. NP171-16904-G4-BF-MF-G4-BF NP171-16904-G4-BF-G4-BF
Description PGA169, IC SOCKET

File Size 138.36K  /  2 Page

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    Black Box, Corp.
Part No. IC264-22501-1-NP-MF IC264-22501-1-PN-MF
Description BGA225, IC SOCKET

File Size 100.68K  /  1 Page

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    IC264-22501-1 IC264-22501-1-MF IC264-22501-1-NN IC264-22501-1-NN-MF IC264-22501-1-NP IC264-22501-1-NP-MF IC264-22501-1-P

Yamaichi Electronics Co., Ltd.
Part No. IC264-22501-1 IC264-22501-1-MF IC264-22501-1-NN IC264-22501-1-NN-MF IC264-22501-1-NP IC264-22501-1-NP-MF IC264-22501-1-PN IC264-22501-1-PN-MF
Description Ball Grid Array (BGA, 1.50mm Pitch)

File Size 191.68K  /  1 Page

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    Qualtek Electronics Cor...
Part No. 1225012-07
Description Qualtek Electronics Corp. WCI DIVISION

File Size 338.09K  /  1 Page

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    DS2250 DS22501

Dallas Semiconductor
Part No. DS2250 DS22501
Description Soft Microcontroller Module

File Size 117.34K  /  19 Page

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    1225016-14

Qualtek Electronics Corporation
Part No. 1225016-14
Description Qualtek Electronics Corp. WCI DIVISION

File Size 338.26K  /  1 Page

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    Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. KB22501
Description DIGITAL CONTROLLED AUDIO PROCESSOR
GENERAL DESCRIPTION

File Size 173.62K  /  8 Page

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    Qualtek Electronics Cor...
Part No. 1225014-10
Description Qualtek Electronics Corp. WCI DIVISION

File Size 338.17K  /  1 Page

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