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Panasonic
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| Part No. |
ADP5270
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| OCR Text |
...on equipments or conditions. 4) rework soldering ? complete rework at a time. ? use a flattened soldering tip when performing rework on the solder bridge. do not add the flux. ? keep the soldering tip below the temperature described in the ... |
| Description |
PS-A Pressure Sensors
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| File Size |
408.57K /
14 Page |
 View
it Online |
Download Datasheet
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FAIRCHILD[Fairchild Semiconductor]
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| Part No. |
RMPA0951AT
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| OCR Text |
... and be a consistent thickness. rework Considerations: rework of a device attached to a board is limited to reflow of the solder with a heat gun. The device should not be subjected to more than 225C and reflow solder in the molten state for... |
| Description |
3V Cellular CDMA PowerEdge Power Amplifier Module
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| File Size |
547.82K /
11 Page |
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it Online |
Download Datasheet |
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FAIRCHILD[Fairchild Semiconductor]
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| Part No. |
RMPA0965
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| OCR Text |
... and be a consistent thickness. rework Considerations: rework of a device attached to a board is limited to reflow of the solder with a heat gun. The device should be subjected to no more than 15C above the solder melting temperature for no... |
| Description |
CDMA and CDMA2000-1X PowerEdge Power Amplifier Module
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| File Size |
513.56K /
8 Page |
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it Online |
Download Datasheet |
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Laird Tech Smart Techno...
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| Part No. |
RECOVR
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| OCR Text |
...ellent for periodic testing or rework applications. ? limited footprint confgurations (l-shapes, etc) ? available in select laird technologies standard board-level sizes or custom confgurations markets or applications ? comp... |
| Description |
Eave-less side walls when the cover is removed
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| File Size |
414.75K /
1 Page |
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it Online |
Download Datasheet |
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Price and Availability
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