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Infineon
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| Part No. |
IPL60R385CP
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| OCR Text |
... compact, lighter, and cooler. thinpak thinpak is a a new leadless smd package for hv mosfets. the new package has a very small footprint of only 64mm2 (vs. 150mm2 for the d 2 pak) and a very low profile with only 1mm height (vs. 4.4mm fo... |
| Description |
MOSFET
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| File Size |
1,552.04K /
13 Page |
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Solidtron
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| Part No. |
SMCTTA20N20A10
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| OCR Text |
... of the following u.s. patents: thinpak tm gate bond area gate return bond area anode bond area opposite side cathode bond area 5,446,316 5,557,656 5,564,226 5,517,058 4,814,283 5,135,890 5,521,436 5,585,310 5,248,901 5,366,932 5,497,013 5... |
| Description |
Power Management
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| File Size |
145.02K /
4 Page |
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it Online |
Download Datasheet |
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Solidtron
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| Part No. |
SMCTTA32N14A10
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| OCR Text |
... of the following u.s. patents: thinpak tm gate bond area gate return bond area anode bond area cathode bond area 5,446,316 5,557,656 5,564,226 5,517,058 4,814,283 5,135,890 5,521,436 5,585,310 5,248,901 5,366,932 5,497,013 5,532,635 5,105... |
| Description |
Advanced Pulse Power Device N-MOS VCS
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| File Size |
703.62K /
5 Page |
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it Online |
Download Datasheet |
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Solidtron
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| Part No. |
SMCTTA65N14A10
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| OCR Text |
...or discharge applications. the thinpak tm package is a perforated, metalized ceramic substrate attached to the silicon using 302 o c solder. an epoxy underfill is applied to protect the high voltage termination from debris. all ext... |
| Description |
Power Management
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| File Size |
208.69K /
5 Page |
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it Online |
Download Datasheet |
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