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  TPM-1100 Datasheet PDF File

For TPM-1100 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

   
Part No. TPM-1100
Description VoP Media Gateway Modules 75kb

File Size 174.27K  /  2 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TPH1100CQ5
Description N-ch MOSFET, 150 V, 49 A, 0.0111 Ω@10 V, High-speed diode, SOP Advance(N)
Tech specs    

Official Product Page

HUA FENG CIRCUIT





   
Part No. TPM-200
Description VoIP Media Gateway Modules 73kb

File Size 172.29K  /  2 Page

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Amphenol Communications Solutions

Part No. 54112-110062000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    PERKINELMER[PerkinElmer Optoelectronics]
Part No. TPMI
Description Thermopile Sensor Module With Integrated Signal Processing

File Size 676.27K  /  5 Page

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Amphenol Communications Solutions

Part No. 89074-1100LF
Description 4 Row Signal Header, Straight, Press-Fit, 2 Mod
Tech specs    

Official Product Page

    PerkinElmer Inc.
Part No. TPMI
Description Thermopile Sensor Module With Integrated Signal Processing

File Size 672.93K  /  5 Page

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Amphenol Communications Solutions

Part No. 54112-107641100LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 64 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SICK AG
Part No. LFV230-XXTNBTPM1100
Description    LEVEL SENSORS

File Size 192.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 10132798-021100LF
Description BergStak® 0.5mm Mezzanine Connector, Board To Board Connectors, 20 position, 2.15mm height receptacle connector.
Tech specs    

Official Product Page

    SICK AG
Part No. LFV230-XXSNBTPM1100
Description LEVEL SENSORS

File Size 192.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 20021211-00006T8LF
Description Minitek127®, Board/Wire to Board connector, Shrouded Vertical Header, Through Hole, Double Row, 6 Positions, 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

    SICK AG
Part No. LFV230-XXTGBTPM1100
Description    LEVEL SENSORS

File Size 192.26K  /  4 Page

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Amphenol Communications Solutions

Part No. 20021611-00012T1LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 12 contacts
Tech specs    

Official Product Page

    B-13-1250-TPM-S B-15-1250-TPM-S

Source Photonics, Inc.
Part No. B-13-1250-TPM-S B-15-1250-TPM-S
Description 1.25 Gbps Bi-directional Single Fiber Transceiver

File Size 798.33K  /  5 Page

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Amphenol Communications Solutions

Part No. 10134811-001LF
Description HPCE VT Receptacle 6LP Omitted 2LP
Tech specs    

Official Product Page

    B-13-155-TPM-S B-15-155-TPM-S B-13/15-155-TPM-SMU3-60

Source Photonics, Inc.
Part No. B-13-155-TPM-S B-15-155-TPM-S B-13/15-155-TPM-SMU3-60
Description 155 Mbps Bi-directional Single Fiber Transceiver
FIBER OPTIC TRANSCEIVER, 1261-1360nm, 155Mbps(Tx), 155Mbps(Rx), THROUGH HOLE MOUNT, MU CONNECTOR

File Size 756.84K  /  5 Page

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Amphenol Communications Solutions

Part No. 10131318-2211100LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 22 Positions, Non GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    Source Photonics
Part No. B-13-15-622-TPM-SXX-60 B-13-15-622-TPM3-SXX-60
Description 622 Mbps Bi-directional Single Fiber Transceiver

File Size 622.91K  /  6 Page

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Amphenol Communications Solutions

Part No. 10131318-0811100LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 8 Positions, Non GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

For TPM-1100 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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