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    TDA7266D

STMICROELECTRONICS[STMicroelectronics]
ST Microelectronics
Part No. TDA7266D
OCR Text ... the ground layer.The number of vias is chosen accordingly to the desired performance (in our demonstration board we use 15 vias). In fig.4 is shown as an example the footprint to be used to create the vias. Figure 4. The above metioned ...
Description 5 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO20
5W 5W DUAL BRIDGE AMPLIFIER

File Size 190.93K  /  13 Page

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    SGA-9189 SGA-9189Z

sirenza.com
SIRENZA[SIRENZA MICRODEVICES]
Part No. SGA-9189 SGA-9189Z
OCR Text ...o reduce lead inductance. Place vias as close to ground leads as possible. RF Output Same as Pin 2 Part Symbolization The part will be symbolized with the "P1" ("P1Z" for RoHS version) designator and a dot signifying pin 1 on the top sur...
Description Medium Power Discrete SiGe Transistor

File Size 95.15K  /  4 Page

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    Semtech
Part No. SC633
OCR Text ...), 4 layer fr4 pcb with thermal vias under the exposed pad per jesd5 standards. (2) tested according to jedec standard jesd22-a 4-b. absolute maximum ratings in (v) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
Description Fixed 5.3V Output Charge Pump Regulator

File Size 564.01K  /  15 Page

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    SGA-9289 SGA-9289Z

sirenza.com
SIRENZA MICRODEVICES
Part No. SGA-9289 SGA-9289Z
OCR Text ...o reduce lead inductance. Place vias as close to ground leads as possible. RF Output Same as Pin 2 Part Symbolization The part will be symbolized with the "P2" ("P2Z" for RoHS version) designator and a dot signifying pin 1 on the top sur...
Description Medium Power Discrete SiGe Transistor

File Size 96.48K  /  4 Page

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    RF MICRO DEVICES INC
Part No. RF5603
OCR Text ...nnection as possible, e.g., pcb vias under the device are recommended. 5 of 24 rf5603 ds101102 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.co...
Description SPECIALTY TELECOM CIRCUIT, QCC16

File Size 2,513.12K  /  24 Page

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    RF3164PCBA-41X RF316406 RF3164

RFMD[RF Micro Devices]
Part No. RF3164PCBA-41X RF316406 RF3164
OCR Text ... the ground plane with multiple vias. The pad should have a short thermal path to the ground plane. Interface Schematic 2-4 Rev A6 060504 RF3164 Application Schematic Output Power Requirements of 28dBm L2 VCC 10 nF 10 F ...
Description    3V 1900MHz LINEAR POWER AMPLIFIER MODULE

File Size 87.68K  /  10 Page

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    SME1400B-10 SME1400B-10-PCB SME1400B-10F

WJ Communication. Inc.
Part No. SME1400B-10 SME1400B-10-PCB SME1400B-10F
OCR Text ...yout 1 2 3 Notes: 1. Ground vias are critical for RF grounding considerations. 2. A minimum of 12 ground vias underneath the device are required. 3. Trace width depends on the PC board material and thickness. LO 8 4 RF 7 6 I...
Description Broadband Surface Mount Mixer

File Size 505.51K  /  5 Page

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    SC615 SC615IMLTRT SC615EVB

Semtech Corporation
Part No. SC615 SC615IMLTRT SC615EVB
OCR Text ...", 4 layer FR4 PCB with thermal vias under the exposed pad per JESD51 standards. 2) Tested according to JEDEC standard JESD22-A114-B Electrical Characteristics Unless otherwise specified: TA = 25C for TYP, -40C to +60C for MIN and MAX; ...
Description Charge Pump Flash LED Driver

File Size 199.22K  /  12 Page

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    ICST[Integrated Circuit Systems]
Part No. 152AMI02 ICS7152AMI-11T 152AM02L 152AM11L 152AMI11 52AMI02L 52AMI11L 7152AM02 7152AM11 ICS7152A ICS7152AM-02 ICS7152AM-02LF ICS7152AM-02LFT ICS7152AM-02T ICS7152AM-11 ICS7152AM-11LF ICS7152AM-11LFT ICS7152AM-11T ICS7152AMI-02 ICS7152AMI-02LF ICS7152AMI-02LFT ICS7152AMI-02T ICS7152AMI-11 ICS7152AMI-11LF ICS7152AMI-11LFT
OCR Text ...de of the PCB. Avoid the use of vias in the decoupling circuit. Crystal Information The crystal used should be a fundamental mode, parallel resonant. Crystal capacitors should be connected from pins X1 to ground and X2 to ground to opti...
Description Spread Spectrum Clock Generator

File Size 105.43K  /  10 Page

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