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BD555A1AFV product structure silicon monolithic integrated circuit this product is not designed protection against rad ioactive rays . 1/15 tsz02201-0f2f0c300010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 03.aug.2012 rev.001 tsz22111 ? 14 ? 001 www.rohm.com datasheet led driver for lighting series electrolytic capacitor free buck converter led driver BD555A1AFV general description BD555A1AFV is a led driver best for led lighting applications. it supports dimming. constant current switching controller for ac/dc buck converter is accumulated inside. by choosing external mos transistor, small large power of led can be driven. the driver is adoptable to a wide range of lighting from small light such as spotlights to large one like ba se lights. with digital power control, the average value of led current is stably adjustable to requesting current. by only primary sense resistor, led current is availabl e to feedback led current is useful without feedback circuits, reduce parts. input characteristics and o utput characteristics is good by precisely digital power control. its support electrolytic free design by capacitor controller which is detect ac voltage and control ceramic capacitor. features highly efficient buck ac/dc converter primary control without feedback circuit high accuracy led current output by led average control capacitor controller for electrolytic free design fixed switching frequency built-in regulator for inner power supply built-in led open detection (shutdown type) built-in uvlo detection built-in thermal shut-down function packages ssop-b14 5.00mm6.40mm1.15mm key specifications ac input range input voltage range(aux pin) operating temperature accuracy of output current 80 to 275v ac 10 to 3 8v -40 to 100 1.5 %( typ.) applications spot light without dimming desk ramp without dimming down light without dimming base light without dimming typical application circuits c ac : 10 f r aux1 :200k ? d aux1 :15v r iset : 1.5 ? d fly l a : 0.2mh vled vbuck tr1 r osc : 100k ? r soft : 100k ? c vdd2 : 2.2 f d aux2 r aux2 :1k ? tr3 c out : 0.1 f l p : 2mh c aux : 0.47 f c vdd1 : 2.2 f d buck gnd isense vout aux vdd1 vdd2 soft osc vdet dvdd dvdd2 csel testo gnda vdd2 fig.1 typical application circuit
2/15 datasheet BD555A1AFV tsz02201-0f2f0c300010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 03.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings (ta=25c) parameter symbol ratings unit conditions maximum applied voltage 1 vmax1 4.5 v vdd2, dvdd, dvdd2, osc, soft, isense pin maximum applied voltage 2 vmax2 15.5 v vdet, vdd1, vout, csel, testo pin maximum applied voltage 3 vmax3 40.0 v aux pin allowable power dissipation *1 pd1 874.7 mw operating temperature topr -40 +100 storage temperature tstg -55 +150 *1 when being mounted on 1 layer substrate(rohm typica l board). copper layer area is 20.2mm 2 . when being used at over ta=25c, pd1 decreases by about 7.00mw/c. recommended operating range (ta=-40c ~ +100c) parameter symbol ratings unit conditions min. typ. max. operating supply voltage aux 10 16 38 v electrical characteristics (unless specified, aux=16 v, ta = +25c) parameter symbol ratings unit conditions min. typ. max. [circuit current] operating current 1 idd1 7.0 14.0 22.0 a at start-up, aux=7.0v operating current 2 idd2 1.5 2.5 3.5 ma when stopping switching [regulator] vdd1 voltage vvdd1 11 12 13 v with no-load vdd1 low voltage detection voltage vuvlo1 4.0 5.0 6.0 v when aux is falling vdd2 voltage vvdd2 2.9 3.3 3.7 v with no-load aux start-up voltage vstup 7.45 8.50 10.00 v when aux is rising aux low voltage detection voltage vuvloaux 6.00 6.50 7.45 v when aux is falling [ switching regulator ] oscillating frequency fosc 90 100 110 khz rosc=open maximum duty dmax - 75.0 - % average current sense voltage visns 475 500 525 mv current sense blank-time tisns t 360 400 440 nsec vout high on-resistance rvouth 3.0 7.0 16.0 ? ivout=20ma source vout low on-resistance rvoutl 2.0 4.5 12.0 ? ivout=20ma sink [ capacitor controller ] ac input h detection voltage deth 340 420 500 mv when vdet is rising ac input l detection voltage detl 240 300 360 mv when vdet is falling vdet input voltage range vvdet -0.3 - 9.0 v csel on-resistance roncs - 10 100 ? icsel=2ma sink csel off-leakage ileakcs - - 1.0 a csel=10v
3/15 datasheet BD555A1AFV tsz02201-0f2f0c300010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 03.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 pin description no i/o C ? 1 dvdd in digital power supply c 2 vdet in ac voltage detection pin(for electrolytic fre e) a 3 aux in power supply input pin a 4 vdd1 out regulator output 1 / inner power supply 12. 0v c 5 vdd2 out regulator output 2 / inner power supply 3.3 v c 6 osc in switching frequency setting pin c 7 dvdd2 in digital power supply c 8 soft in soft-start ? slope time setting pin c 9 vout out switching mos gate driver pin d 10 isense in current sense pin c 11 gnd - gnd pin b 12 gnda - gnd pin d 13 csel out capacitor selector pin(for electrolytic fr ee) a 14 testo out test output pin c pin configuration 1 14 2 13 3 12 4 11 5 10 6 9 7 8 testo csel gnda gnd isense vout soft dvdd vdet aux vdd1 vdd2 osc dvdd2 fig.2 pin configuration equivalent circuit diagram aux c a aux b gnd d fig.3 equivalent circuit diagram block diagram vdd2 vdd1 r egulator internal power supply osc vo1=12.0v vo2= 3.3v vref iref aux osc vout isense soft gnda gnd protection circuit d/a comp a/d s q r - + led average current control logic dimming control logic soft start timer dimming control led current control tsd uvlo scp led open power supply csel vdet capacitor control dvdd dvdd2 capacitor control logic testo - + fig.4 block diagram top view
4/15 datasheet BD555A1AFV tsz02201-0f2f0c300010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 03.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 description of blocks 1) regulator regulator with output of typ.3.3v is built in, which places aux pin at input. when ac power source is inp ut, according to clamp voltage of zener diode (d aux ), power is supplied to aux pin through start-up res istor (r aux ). until aux pin gets typ.8.5v, switching operation is kept stopped. circ uit current is typ.10 a, so that voltage drop of r aux can be kept small. when aux pin becomes typ.8.5v, switching operation s tarts. after the start of switching operation, it is recommended that power is supplied to aux pin by fly-back method thro ugh transformer (l aux ). output voltage of vdd2 is used at circuit inner powe r supply. when vdd2 pin becomes below typ.2.45v, uvlo detection is carried out and it leads to a non-operating stat e. 2) soft start soft start bring good effect which is smoothing ligh t on at power on and prevent the led short protectio n in power on, if output capacitor is big. soft start limits duty of switching and increases th e set value of led peak current from low level by sl ope function. soft start is run only one time when the ac power is supplied. when vdd2 pin detect low voltage, this fun ction is reset and run again when next ac power source is input (when l ow voltage detection is canceled). ac p ower supply (50hz/60hz) led current 100% t dimming decoder (internal resister value ) sampling data (internal resister value) h 0h ffh s lope c ontro l 01 h 02 h 0 % fdh fe h 03 h ff h soft s tart t ime ac line (vbuck) aux vdd1 aux : 16v(recommend ation ) vdd 2 : 3.3 v uvlo: 8.5v start startstart start- -- -up upup up soft softsoft soft- -- -start startstart start normal normal normal normal fig.5 soft start soft start time can be set by resistor (r soft ) connecting to soft pin. soft start time, t soft is shown as in below chart. r soft , setting of soft-start slope time r soft soft-start slope time 100k ? 100msec 39k ? 800msec 24k ? 1600msec no connection 0msec (no slope)
5/15 datasheet BD555A1AFV tsz02201-0f2f0c300010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 03.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 3) digitally controlled switching converter ? ?? ? operation description of buck converter when aux becomes typ.8.5v, switching controller star ts its switching operation. switching frequency is d etermined depending on the value of resistor (r osc ) connecting to osc pin. at the beginning of switching cycle, fet tr1 for switching turns on. coil current flows into r iset and current is detected by isense pin. however even tr1 turns on, current detec tion is not carried out for a definite period of ti me, typ.400nsec. it prevents a malfunction caused by reverse recovery c urrent of freewheel diode (d out ), when tr1turns on. tr1 turns off, so that the voltage of isense pin increases linearly a nd led average current is adjusted to requested curr ent. switching duty(d) is generally shown as below formul a, considering input voltage as vbuck and output vol tage as vled. vbuck vled d = when switching duty (d) reaches to maximum 75.0% (t yp.), the status is forced to change into off. more over minimum on width is 400nsec (typ.). for 400nsec, on status is maintained compulsorily. ? ?? ? setting of led current switching controller adjusts the average current of coil to a value which is set by r iset, monitoring coil current at switching on from isense pin. since the average current of coil and led current are of equivalent value, setting of led current is determined by controlling the average current of co il. led average current, i ave is determined by ripple current i l of coil. peak current is shown as below formula in continuous current mode (ccm). compute i l from the data sampled with a/d converter from isense pi n, and calculate peak current i peak, so that average current becomes requested value. input peak current i peak into d/a converter and treat it as reference voltag e of comparator comp. since i l is calculated and feed-backed, average current con trol is available without influence of input voltag e ? output voltage ? constant of coil ? switching frequency which are change by i l. 2 ? i i i l peak ave - = t i ave t on t off i peak i l led current fig.6 waveform of led current (in continuous current mode) c ac :10 f c out : 0.1 f d o ut r iset :1.5 ? l sw: 1mh vled vbuck tr1 r osc : 100k ? osc 20-300k hz osc vout isense gnd comp s q r - + led average current control logic led current control d/a a/d dimming protect fig.7 block diagram of average current control
6/15 datasheet BD555A1AFV tsz02201-0f2f0c300010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 03.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 led average current i ave is set by resistor (r iset ) connecting isense pin. each set-up current is indicat ed as below formula. setting current is chosen drive current of external mos fet. average current sense voltage, visn s is set to 500mv. iset ave r visns i = r iset , set-up examples of led average current r iset led average current 5.10 ? 98ma 2.00 ? 250ma 1.50 ? 333ma 1.00 ? 500ma 0.75 ? 667ma 0.68 ? 735ma fig.8 shows input voltage characteristics when r iset is 1 ? . and fig.9 indicates output voltage characteristic s. fig.8 input voltage (vpri) vs. led current fig.9 ou tput voltage (vled) vs. led current under the following conditions, it is difficult to control average current. 1.) when on time is 400nsec. on time, t on, is indicated as follows, considering switching freq uency as f sw . sw on f vbuck vled t 1 ?? ? ?? ? = when input voltage is high, output voltage is low o r switching frequency is high, there is a possibili ty that on time becomes 400nsec. switching frequency is recommended to be set low. 2.) when switching duty (d) is 75.0%. switching duty (d) is expressed as follows. vbuck vled d = when input voltage is low or output voltage is high , there is a possibility switching duty (d) exceeds 75.0%. it is necessary to keep input voltage high or make output voltage low.
7/15 datasheet BD555A1AFV tsz02201-0f2f0c300010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 03.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 3.) in case of dcm discontinuous current mode in ccm, digitally controlled switching converter ca rries out average current control. in dcm, since cu rrent of section where no current flows cannot be controlled , led current value becomes lower than set-up curren t value. t i ave t on t off i peak led current loss fig.10 waveform of led current (in discontinuous cur rent mode) dcm occurs when led set-up current is low or switchi ng frequency is low. switching frequency is recommended to set high. ? ?? ? setting of switching frequency in setting of switching frequency, a relation of tr ade-off holds between power efficiency and the size (price) of external components. to improve power efficiency, slower swi tching frequency is better but in that case, the si ze of external parts get bigger. maximum switching frequency is decided by minimum o n time. minimum on time (t on(min) ) is available when input voltage vbuck is highest v oltage and output voltage vled is minimum,. it is shown as below formula. sw (max) (min) on(min) f vbuck vled t 1 ? ?? ? ? ?? ? = switching duty (d) is simply shown as following form ula. frequency switching : sw f sw on f t vbuck vled d = = set switching frequency within 20khz 300khz. determine it so that minimum on time (t on(min) ) gets more than 400nsec. switching frequency f osc is determined by resistor r osc connecting to osc pin. each set-up frequency is indicated as below formula. however if rosc is not connected, it is set to 100 khz. moreover if rosc is short-circuit to gnd, it is set to 20khz. ] [ / 8192 ] [ k rosc khz = osc f r osc setting example of switching frequency r osc switching frequency 300 k 28khz 150 k 50khz 68 k 120khz 27 k 300khz no connection 100khz
8/15 datasheet BD555A1AFV tsz02201-0f2f0c300010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 03.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 protection function 1) detection of abnormal temperature thermal shut down starts to operate over 150c(typ. ), making ic from active status to non-active statu s. in the non-active status, switching operation stops. gate driver outp ut turns into low impedance against gnd. when the temperature of ic returns to normal level, ic recovers from initial mode to active mode. 2) vdd1 low voltage detection when vdd1 power supply voltage is low or any abnorma l status occurs such as vdd1pin short, ic is turned to non-active status from active mode, since there is a possibili ty that ic does not operate properly. in non-active mode, switching operation stops. gate driver output turns into low impedance against gnd. when vdd1power supply voltage returns to normal leve l, ic recovers from initial mode to active mode. 3) vdd2 low voltage detection when vdd2 power supply voltage is low or any abnorma l problem occurs such as vdd2 pin short, ic is turn ed to non-active mode, since there is a possibility that ic does not operate properly. in non-active mode, s witching operation stops. gate driver output turns into low impedance against gnd. when vdd2power supply voltage returns to normal leve l, ic recovers from initial mode to active mode. 4) aux low voltage detection when aux power supply voltage is low or any abnormal problem occurs such as aux pin short, ic is turned non-active, since there is a possibility that ic does not opera te properly. in non-active mode, switching operatio n stops. gate driver output turns into low impedance against gnd. when aux power supply voltage returns to normal leve l, ic recovers from initial mode to active mode. 5) led open detection ic is turned from active mode to non-active mode, w hen isense pin voltage does not reach to average curre nt value for 52.4msec because of leds open defects, open isense pin, coi ls open defects and so on. in non-active mode, switching operation stops. gate driver output turns into low impedance against gnd. led open detection holds non-active mode until vdd2 low voltage detection is carried out. ic recovers to a ctive mode in following flow; switching operation stops vdd2 low voltage detection works ledopen detection is re-set. 6) led gnd short detection ic is turned from active mode to non-active mode, w hen isense pin voltage does not reach to average curr ent value for 52.4msec because of leds gnd short defects, short isense pin. in non-active mode, switching operation stops. gate driver output turns into low impedance against gnd. led open detection holds non-active mode until vdd2 low voltage detection is carried out. ic recovers to a ctive mode in following flow; switching operation stops vdd2 low voltage detection works led gnd short detection is re-set.
9/15 datasheet BD555A1AFV tsz02201-0f2f0c300010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 03.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves fig.11 current consumption1 fig.12 current consum ption.2 fig.13 vdd2 voltage fig.14 switching frequency - 40 25 150 - 40 25 150 - 40 25 150
10/15 datasheet BD555A1AFV tsz02201-0f2f0c300010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 03.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 fig.15 average current sense voltage fig.16 led current accuracy fig.17 ac input voltage characteristics fig.18 output vol tage characteristics 3 ? :1.5%
11/15 datasheet BD555A1AFV tsz02201-0f2f0c300010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 03.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 application examples 1) basic circuit (buck) connect about leds in series. connect 1.5 ? resistor to r iset and set led average current to 333ma. select external mos-fet depending on led current. recommendation r5205cnd:rohm set aux power supply to over 12.0v. at start up, power is supplied through tr3. when aux exceeds start-up voltage 8.5v, switching operation starts. in switching operation, power is supplied via transformer. connect vdet pin to vdd2. connect dvdd and dvdd2 to vdd2, too. switching frequency is set by connecting resis tor between osc pin and gnd. slope time of dimming can b e set by connecting resistor between soft pin and gn d. c ac : 10 f r aux1 :200k ? d aux1 :15v r iset : 1.5 ? d fly l a : 0.2mh vled vbuck tr1 r osc : 100k ? r soft : 100k ? c vdd2 : 2.2 f d aux2 r aux2 :1k ? tr3 c out : 0.1 f l p : 2mh c aux : 0.47 f c vdd1 : 2.2 f d buck vdd2 gnd isense vout aux vdd1 vdd2 soft osc vdet dvdd dvdd2 csel testo gnda fig.19 application example (high-power led 333ma) 2 ) design for more compact circuit, reducing number of components supply power through r aux. when aux exceeds start-up voltage, 8.5v, switching o peration starts. in steady state, set aux voltage to over 12v. since about 3ma power loss ( 0.3w: at ac100v occurs at r aux, efficiency gets worse compared to the basic circuit. make osc and soft pins open. at this time, switching f requency becomes 100khz and soft time is 0msec. vdd2 c ac : 10 f r iset : 1.5 ? vled vbuck tr1 r osc : 100k ? r soft : 100k ? c vdd2 : 2.2 f r aux :33k ? c out : 0.1 f l p : 2mh c aux : 0.47 f c vdd1 : 2.2 f d buck gnd isense vout aux vdd1 vdd2 soft osc vdet dvdd dvdd2 csel testo gnda fig.20 application example miniaturization high-power led 333ma
12/15 datasheet BD555A1AFV tsz02201-0f2f0c300010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 03.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 3) circuit example for electrolytic free connect vdet and csel pin to the electrolytic capacito r less circuit. this application is not used electrolytic-capacitor , is used two ceramic-capacitor. two capacitor cont rols is available to stable constant led current, when ac input voltage is low. c ac : 10 f r aux1 :200k ? d aux1 :15v r iset : 1.5 ? d fly l a : 0.2mh vled vbuck tr1 r osc : 100k ? r soft : 100k ? c vdd2 : 2.2 f d aux2 r aux2 :1k ? tr3 c out : 0.1 f l p : 2mh c aux : 0.47 f c vdd1 : 2.2 f d buck vdd2 gnd isense vout aux vdd1 vdd2 soft osc vdet dvdd dvdd2 csel testo gnda electrolytic capacitor less circuit r vdet1 :1m ? r vdet2 :10k ? d ac fig.21 application example electrolytic free high-power led 333ma
13/15 datasheet BD555A1AFV tsz02201-0f2f0c300010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 03.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 operational notes (1) absolute maximum ratings an excess in the absolute maximum ratings, such as s upply voltage, temperature range of operating condi tions, etc., can break down devices, thus making impossible to ident ify breaking mode such as a short circuit or an ope n circuit. if any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) operating conditions these conditions represent a range within which cha racteristics can be provided approximately as expec ted. the electrical characteristics are guaranteed under the conditions of each parameter. (3) power supply line design pcb pattern to provide low impedance for the w iring between the power supply and the gnd lines. i n this regard, for the digital block power supply and the analog b lock power supply, even though these power supplies has the same level of potential, separate the power supply patte rn for the digital block from that for the analog b lock, thus suppressing the diffraction of digital noises to the analog blo ck power supply resulting from impedance common to the wiring patterns. for the gnd line, give consideration to design the patterns in a similar manner. furthermore, for all power supply terminals to ics, mount a capacitor between the power supply and the gnd terminal. at the same time, in order to use an electrolytic capa citor, thoroughly check to be sure the characterist ics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determ ining the constant. (4) gnd voltage make setting of the potential of the gnd terminal s o that it will be maintained at the minimum in any operating state. furthermore, check to be sure no terminals are at a potential lower than the gnd voltage including an actual electric transient. (5) short circuit between terminals and erroneous mo unting in order to mount ics on a set pcb, pay thorough atte ntion to the direction and offset of the ics. errone ous mounting can break down the ics. furthermore, if a short circuit occurs due to foreign matters entering between ter minals or between the terminal and the power supply or the gnd terminal, the ics can break down. (6) operation in strong electromagnetic field be noted that using ics in the strong electromagneti c field can malfunction them. (7) inspection with set pcb on the inspection with the set pcb, if a capacitor is connected to a low-impedance ic terminal, the ic c an suffer stress. therefore, be sure to discharge from the set pcb by e ach process. furthermore, in order to mount or dism ount the set pcb to/from the jig for the inspection process, be sure to turn off the power supply and then mount the se t pcb to the jig. after the completion of the inspection, be sure to turn o ff the power supply and then dismount it from the j ig. in addition, for protection against static electricity, establish a ground for the assembly process and pay thorough at tention to the transportation and the storage of the set pcb. (8) input terminals in terms of the construction of ic, parasitic eleme nts are inevitably formed in relation to potential. the operation of the parasitic element can cause interference with circu it operation, thus resulting in a malfunction and t hen breakdown of the input terminal. therefore, pay thorough attention n ot to handle the input terminals, such as to apply to the input terminals a voltage lower than the gnd respectively, so that an y parasitic element will operate. furthermore, do n ot apply a voltage to the input terminals when no power supply voltage is applied to the ic. in addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than t he power supply voltage or within the guaranteed va lue of electrical characteristics.
14/15 datasheet BD555A1AFV tsz02201-0f2f0c300010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 03.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 (9) ground wiring pattern if small-signal gnd and large-current gnd are provi ded, it will be recommended to separate the large-c urrent gnd pattern from the small-signal gnd pattern and establish a s ingle ground at the reference point of the set pcb so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in volta ges of the small-signal gnd. pay attention not to cause fluctuations in the gnd wiring pattern of external parts as well. (10) external capacitor in order to use a ceramic capacitor as the external capacitor, determine the constant with considerati on given to a degradation in the nominal capacitance due to dc bi as and changes in the capacitance due to temperatur e, etc. (11) thermal shutdown circuit (tsd) when junction temperatures become higher than detec tion temparatures, the thermal shutdown circuit ope rates and turns a switch off. the thermal shutdown circuit, which is aimed at isolating the lsi from thermal runaway as much as possible, is not aimed at the protection or guarantee of the lsi. therefore, do not continuously use the lsi with thi s circuit operating or use the lsi assuming its operation. (12) thermal design perform thermal design in which there are adequate m argins by taking into account the permissible dissi pation (pd) in actual states of use. (13) selection of coil select the low dcr inductors to decrease power loss for dc/dc converter. (14) the temperature range of operation guarantees functional operation only. the life of lsi is not gu aranteed in this range. the life of lsi has derating according to the environmen t, such as ta, humidity, voltage and so on. in perf orming an apparatus design, please perform the design in consideration of life derating of lsi. (15) about the function description or technical not e or more the function description and the application notebo ok are the design materials to design a set. so, the contents of the materials arent always guaranteed. please design a pplication by having fully examination and evaluati on include the external elements. status of this document the japanese version of this document is formal spe cification. a customer may use this translation ver sion only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority
15/15 datasheet BD555A1AFV tsz02201-0f2f0c300010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 03.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 ordering information b d 5 5 5 a 1 a f v - e 2 product name package fv : ssop-b14 packaging and forming specification e2: embossed tape and reel physical dimension tape and reel information marking diagram 555a1 lot no. 1pin mark a
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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