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vjdr1104p - 4c81c - tr 1608(t=1.15 mm) type, lens color: water clear outer dimension 1.64 x 0.84 x 1.15mm ( l x w x h ) ? five times brighter than current vfhr1104p ? compliant with jedec msl - 3 (ipc/jedec j - std - 020d) ? soldering pad for current 1608 size (1111c) available ? narrow spatial distribution suitable for light distribution on limited irradiation area ? lead C free soldering compatible ? rohs compliant ? automotive interior, communication machine, electric household appliances, oa/fa, other general applications standard product reference sheet features recommended applications package product features 2017/10/9 page : 1
vjdr1104p - 4c81c - tr unit :mm weight :1.7mg tolerance : 0.1 outline dimensions recommended pad unit mm 2017/10/9 page : 2 note the cutting burr size of the print circuit board and electrode isn't contained in the size of the height of the product. no. part name remarks qty. led die algainp 1 plastic epoxy resin 1 substrate glass fabrics 1 pin au/ni/cu 2
vjdr1104p - 4c81c - tr rth (j - a)measuring condition ? pcb fr - 4 t=1.6mm) ? pattern size 16mm 2 specifications 2017/10/9 page : 3 thermal characteristics junction temperature tj 120 max. item units esd storage temperature t stg note 1 note 2 i f derate linearly from "75 " note3. thermal resistance junction - ambient r th(j-a) - 550 - thermal resistance junction - solder point esd testing method : eiaj4701/300(304) human body model(hbm) 1.5k,100pf min. typ. max. note3 r th(j-s) - 350 - /w /w (ta=25 ) please refer to page a-1, soldering conditions. symbol item i frm 100 t opr reverse voltage v r 5 (ta=25 ) power dissipation p d i frm derate linearly from "75 " symbol maximum ratings units mw water clear absolute maximum ratings 78 repetitive peak forward current "1ms,1/20duty" algainp red product overview resin color( emitting area) die material emitting colpr -40 +100 note1 forward current v t sld i f 1.00 ma/ 260 max ma operating temperature soldering temperature "reflow soldering" electrostatic discharge threshold "hbm" i f 30 ma i frm 3.33 ma/ note2 1,000 v -40 +105
vjdr1104p - 4c81c - tr 2017/10/9 specifications page : 4 note above luminous intensity (i v ) values and dominant wavelength ( d) values are the setup value of the selection machine. tolerance : i v 10%, d 1nm item units nm dominant wavelength nm peak wavelength 820 - i f = 20ma deg. half intensity angle nm 21/2 forward voltage reverse current spectral line half width luminous intensity luminous flux 390 i f = 20ma 632 - ? i f = 20ma 80 v r = 5v - 10 - - mlm v 1.9 v f 2.5 (ta=25 ) i f = 20ma min. typ. max. electro and optical characteristics 2.1 symbol conditions i f = 20ma i r i f = 20ma i v v 930 560 a - p mcd 655 i f = 20ma - - above luminous intensity (i v ) values and dominant wavelength (d) value are the setup value of the selection machine tolerance : iv10% d1nm 15 d note: - 635 638 - c 632 638 i f =20ma t a=25 d (nm) min. max. conditions conditions 470 560 cy 680 820 i v (mcd) sorting for luminous intensity and dominant wavelength leds shall be sorted out into the following ranks of luminous intensity and dominant wavelength. 390 min. c8 max. luminous intensity (iv) rank rank rank dominant wavelength (d) rank cx 560 680 c9 470 i f =20ma ta=25
vjdr1104p - 4c81c - tr 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 550 560 570 580 590 600 610 620 630 640 650 660 670 680 690 700 x direction y direction spectral distribution condition: ta = 25 , i f =20ma wavelength: (nm ) relative intensity spatial distribution condition: ta = 25 , i f =20ma relative intensity : ( %) technical data y x 2017/10/9 page : 5
vjdr1104p - 4c81c - tr forward voltage vs. forward current condition : ta = 25 forward voltage: v f (v ) forward current: i f (ma) ambient temperature vs. relative intensity condition: i f = 20ma ambient temperature: ta ( ) forward current vs. relative intensity condition: ta = 25 forward current: i f (ma) ambient temperature vs. forward voltage condition: i f = 2 - 30ma ambient temperature: ta ( ) forward voltage: v f (v) relative intensity relative intensity technical data 2017/10/9 page : 6 0.0 0.5 1.0 1.5 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 ci 0.1 1 10 -40 -20 0 20 40 60 80 100 1 10 100 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 85 100 60 25 0 - 40 - 20 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 -40 -20 0 20 40 60 80 100 10ma 5ma 2ma 30ma 20ma 15ma
vjdr1104p - 4c81c - tr max. forward current vs. duty cycle condition : ta = 25 duty cycle: (%) max. forward current vs. ambient temperature repetition frequency : f R 50hz ambient temperature: ta ( ) dominant wavelength : d (nm) forward current vs. dominant wavelength condition: ta = 25 forward current: i f (ma) ambient temperature vs. dominant wavelength condition : i f = 20ma ambient temperature: ta ( ) maximum forward current : i fmax . (ma) dominant wavelength : d (nm) maximum forward current : i fmax . (ma) technical data 2017/10/9 page : 7 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120 dc duty 10% duty 20% duty 50% duty 5% 1 10 100 1 10 100 610 615 620 625 630 635 640 0 10 20 30 610 615 620 625 630 635 640 -40 -20 0 20 40 60 80 100
vjdr1104p - 4c81c - tr page : 8 soldering condition 1. heat stress during soldering will influence the reliability of leds, however that effect will vary on heating method. also, if components of varying shape are soldered together, it is recommended to set the soldering pad temperature according to the component most vulnerable to heat (e.g., surface mount led). 2. led parts including the resin are not stable immediately after soldering ( when they are not at room temperature), any mechanical stress may cause damage to the product. please avoid such stress after soldering, especially stacking of the boards which may cause the boards to warp and any other types of friction with hard materials . 3. recommended temperature profile for the reflow soldering is listed as the temperature of the resin surface. temperature distribution varies on heating method, pcb material, other components in the assembly, and mounting density. please do not repeat the heating process in reflow process more than twice. notes 1 temperature profile for the reflow should be set to the surface temperature of resin which is on the top of led. this should be the maximum temperature for soldering. lowering the heating temperature and decreasing heating time is very effective in achieving higher reliability . notes 2 the reflow soldering process should be done up to twice(2 times max). when second process is performed , interval between first and second process should be as short as possible to prevent absorption of moisture to resin of led. the second soldering process should not be done until leds have returned to room temperature (by nature - cooling) after first soldering process. soldering precaution (acc.to:eiaj - 4701/300) 2017/10/9 page : 8 recommended reflow soldering condition 40 sec max. 150 180 + 1.5 + 5 /s 260 max. - 1.5 - 5 /s 90 ~ 120 sec pre - heating (soldering 230 max. peak temperature
vjdr1104p - 4c81c - tr page : 9 soldering condition 4. if soldering manually, stanley recommends using a soldering iron equipped with temperature control. during the actual soldering process , make sure that the soldering iron never touches the led itself, and avoid the led's electrode heating temperature reaching above the heating temperature of the solder pad. all repairs must be performed only once in the same spot, and please avoid reusing components. 5. in soldering process, immediately after iron tip is cleaned, please make sure that the soldering iron reaches the appropriate temperature before using. also, please avoid applying any types of pressure to the soldered components before the solder has been cooled and hardened, as it may deteriorate solder performance and solder quality. 6. when using adhesive material for tentative fixatives, thermosetting resin or ultraviolet radiation (uv) setting resin with heat shall be recommended. the curing condition, temperature:150 max./ time:120sec.max . 7. flow soldering (dip soldering) is not recommended for this product. 8. isopropyl alcohol is recommended for cleaning. some chemicals, including freon substitute detergent could corrode or affect the optical characteristics of the lens or the casing surface. please review the reference chart below for cleaning. cleaning with ultrasonic shall not be recommended . recommended manual soldering condition temperature of iron tip 350 max. soldering duration, time 3sec.max.,1 time 2017/10/9 page : 9 chemical ? isopropyl alcohol ? ethyl alcohol ? pure water ? trichloroethylene chlorothene acetone thinner
vjdr1104p - 4c81c - tr handling precaution other precautions 1. stanley led lamps have semiconductor characteristics and are designed to ensure high reliability. however, the performance may vary depending on usage conditions. 2. absolute maximum ratings are set to prevent led lamps from failing due to excess stress( temperature, current, voltage, etc.). usage conditions must not exceed the ratings for a moment, nor do reach one item of absolute maximum rating s simultaneously . 3. in order to ensure high reliability from led lamps, variable factors that arise in actual usage conditions should be taken it to account for designing. ( derating of typ., max forward voltage, etc.) 4. please insert straight protective resistors into the circuit in order to stabilize led operation and to prevent the device from igniting due to excess current. 5. please avoid using the products with materials and products that contain sulfur and chorine element which will decrease the reliability of led. please keep led in desiccator to protect them from corrosive gas regardless of whether mounting is finished or not. also please make sure there is no gas occurs around or gas inflows from outside when using led. 6. please check the actual performance in the assembly because the specification sheets are described for led device only. 7. please refrain from looking directly at the light source of led at high output, as it may harm your vision. 8. the products are designed to operate without failure in recommended usage conditions. however, please take the necessary precautions to prevent fire, injury, and other damages should any malfunction or failure arise 9. the products are manufactured to be used for ordinary electronic equipment. please contact our sales staff beforehand when exceptional quality and reliability are required, and the failure or malfunction of the products might directly jeopardize life or health ( such as for airplanes, aerospace, transport equipment, medical applications, nuclear reactor control systems and so on). 10. the formal specification sheets shall be valid only by exchange of documents signed by both parties. page : 10 2017/10/9
vjdr1104p - 4c81c - tr packaging specifications this product is baked (moisture removal) before packaging, and is shipped in moisture - proof packaging (as shown below) to minimize moisture absorption during transportation and storage. however, with regard to storing the products, stanley recommends the use of dry - box under the following conditions is recommended. moisture - proof bag as the packaging is made of anti - static material but packaging box is not. the package should not be opened until immediately prior to its use, and please keep the time frame between package opening and soldering which is maximum 168h . if the device needs to be soldered twice, both soldering must be completed within the 168h . if any components should remain after their use, please seal the package and store them under the conditions described in the recommended storage condition . this product must be required to perform baking process (moisture removal) for at least 24h,not exceed for 72h, at 60+ 5 degrees celsius if following conditions apply. 1. in the case of silica gel (blue) which indicates the moisture level within the package, changes or loses its blue color. 2. in the case of time is passed for 168h after the package is opened once. baking process should be performed after led having been taken out of the package. baking may be performed in the tape - reel form , however if it is performed with the reel stacked over one another, it may cause deformation of the reels and taping materials and later obstruct mounting. please handle only once it has returned to room temperature. provided that, baking process shall be 2 times max. time elapsed after package opening. in the case of the package unopened , 6 months under recommended storage condition . please avoid rapid transition from low temp. condition to high temp. condition and storage in corroding and dusty environment. recommended storage condition / products warranty period temperature +5 30 humidity under 70% page : 11 2017/10/9
vjdr1104p - 4c81c - tr packaging specification moisture - proof packaging specification fastener for re - storage after opening bag customer's opening position product label (desiccant with indicator for moisture level is enclosed .) a flow chart - package opening to mounting heat sealing position (after product being put in) allowable leaving time means the maximum allowable leaving time after opening package, which depends on each led type. the allowable leaving time should be calculated form the first opening of package to the time when soldering process is finished. when judging if the allowable leaving time has exceeded or not, please subtract the soldering time. the allowable leaving time after reopening should be calculated form the first opening of package, or from the time when baking process is finished. page : 12 2017/10/9 yes no yes no yes no baking led under recommended condition product mounting unused-product remained return to moisture-proof package and seal finished reopen the moisture-proof package flow chartpackage opening to mounting stored under recommended condition moisture-proof package first time opening allowable leaving time exceeded (*) discoloration of silica gel no. part name material remarks moisture-proof bag with aluminum layer pet+al+pe with esd protection
vjdr1104p - 4c81c - tr packing box (rohs ? elv compliant) the above measure is all the reference value. box for shipment is selected out of the above table, according to the shipping quantity. packaging specifications box type outline dimension l w h (mm) capacity of the box type a 280 265 45 3 reels type b 310 235 265 15 reels type c 440 310 265 30 reels page : 13 2017/10/9 b type a material / box cardboard c5bf type b,c material / box cardboard k5af partition cardboard k5bf no. part name material remarks packing box corrugated cardboard without esd protection
vjdr1104p - 4c81c - tr label specification ( acc.to jis - x0503(code - 39) ) product label a. parts number b. bar - code for parts number c . parts code (in - house identification code for each parts number) d. packed parts quantity e. bar - code for packed parts quantity f. lot number & rank ( refer to lot number notational system for details ) g . bar - code for lot number & rank opto device label a. customer name b. parts type c. parts code d. parts number e. packed parts quantity f. carton number g. shipping date h. bar - code for in - house identification number < remarks> bar - code font : acc.to code - 39(jix0503) packaging specifications b a page : 14 2017/10/9
vjdr1104p - 4c81c - tr taping and reel specifications ( acc.to jis - c0806 - 03 ) appearance items specifications remarks leader area cover - tape cover - tape shall be longer than 320mm without carrier - tape the end of cover - tape shall be held with adhesive tape. carrier - tape empty pocket shall be more than 25 pieces. please refer to the above figure for taping & reel orientation . trailer area empty pocket shall be more than 40 pieces. the end of taping shall be inserted into a slit of the hub. page : 15 note " - tr" means cathode s ide of leds should be placed on the sprocket - hole side. 2017/10/9
vjdr1104p - 4c81c - tr taping and reel specifications (acc.to jis - c0806 - 03 ) 3,000parts/reel minimum qty. per reel might be 500 parts when getting less than 3 ,000 parts. in such case, parts of 500 - unit - qty. shall be packed in a reel and the qty . shall be identified on the label cover - tape adhesive strength shall be 0.1 1.0n ( an angle between carrier - tape and cover - tape shall be170 deg. ) both tapes shall be so sealed that the contained parts will not come out from the tape when it is bent at a radius of 15mm. reversed - orientation, up - side down placing, side placing and out of spec. parts mix shall not be held. max qty. of empty pocket per reel shall be defined as follows. qty . per reel mechanical strength others page : 16 2017/10/9 remarks max. qty. of empty pocket qty./reel 1,500 2 1 3,000 1,000 1 - 2,000 - 2 2,500 no continuance no continuance 3 no continuance - 500 1
vjdr1104p - 4c81c - tr taping dimensions reel dimensions taping and reel specifications ( acc.to jis - c0806 - 03 ) unit :mm page : 17 2017/10/9 no. part name remarks carrier-tape cover-tape conductive grade anti-static grade conductive grade carrier-reel
vjdr1104p - 4c81c - tr lot number notational system - 1digit production location (mark identify alphabet) - 1digit production year (last digit of production year shall be indicate as 20099,20100,20111, ??? ) - 2digits production month (jan. to sep. ,shall be indicated as 01,02,03 , ????? ) - 2digits production date - 3digits serial number - 2digits tape and reel following number - 2digits luminous intensity rank. (if luminous intensity rank is 1 digit, " - " shall be dashed on the place for the second digit. if there is no identified rank, " - - " shall be used to indicate.) - 2digits chromaticity rank ( if c hromaticity rank is 1 digit, " - " shall be dashed on the place for the second digit. if there is no identified rank , " - - " shall be used to indicate .) - 1digit option rank (stanley normally print " - " to indicate.) page : 18 2017/10/9
vjdr1104p - 4c81c - tr correspondence to rohs ? elv instruction this product is in compliance with rohs ? elv. prohibition substance and it's criteria value of rohs ? elv are as follows. ? rohs instruction refer to following (1) (6). ? elv instruction . refer to following (1) (4). substance group name criteria value (1) lead and its compounds 1,000ppm max (2) cadmium and its compounds 100ppm max (3) mercury and its compounds 1,000ppm max (4) hexavalent chromium 1,000ppm max (5) pbb 1,000ppm max (6) pbde 1,000ppm max page : 19 2017/10/9
vjdr1104p - 4c81c - tr reliability testing result 1. reliability testing result 2. failure criteria page : 20 1 maximum rated current at maximum rated operating temperature 2017/10/9 item symbol condition failure criteria luminous intensity iv i f = 20 a testing m in. value standard m in. value 0.5 forward voltage v f i f = 20 a testing m ax. value R standard m ax. value 1.2 reverse current i r v r = 5v testing m ax. value R standard m ax. value 2.5 external appearance - - notable discoloration, deformation and cracking test condition ta=25 maximum rated current ta=85 maximum rated current ta=-40 maximum rated current 1,000h 1,000h wet high temperature storage life eiaj ed-4701 /300(304) c=200pf r2=0?200v once of each polarity 0 / 10 0 / 20 1,000 cycles 1,000h low temperature storage life ta=60 rh=90% ta= tstg max. tstg min. (15min of each) electric static discharge(esd) : mm eiaj ed-4701 /100(101) 1,000h wet high temperature operating life eiaj ed-4701 /100(102) ta=60 rh=90% maximum rated current ta = tstg max. maximum storage temperature low temperature operating life eiaj ed-4701 /200(201) duration 0 / 20 0 / 20 high temperature storage life eiaj ed-4701 /200(202) eiaj ed-4701 /100(105) thermal shock ta = tstg min. minimum storage temperature reference standard test item 1,000h high temperature operating life eiaj ed-4701 /100(101) operating life eiaj ed-4701 /100(101) 0 / 20 0 / 20 0 / 20 1,000h 1,000h failure 0 / 20 0 / 20 eiaj ed-4701 /300(301) moisture soak 30 70% 72h preheating 150 180 120sec max. soldering 260 5sec twice eiaj ed-4701 /100(101) 0 / 20 vibration, variable frequency eiaj ed-4701 /400(403) 98.1m/s2(10g) 100 2000hz 20min sweep xyz direction 2h of each direction 0 / 10 resistance to reflow soldering electric static discharge(esd) : hbm eiaj ed-4701 /300(304) c=100pf r2=1.5k 2000v once of each polarity 0 / 10
vjdr1104p - 4c81c - tr special notice to customers using the products and technical information shown in this data sheet 1) the technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. it does not constitute the warranting of industrial property nor the granting of any license. 2) for the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. therefore it is recommended that the most updated specifications be used in your design. 3) when using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. we are not responsible for any damage which may occur if these specifications are exceeded. 4 ) the products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (oa equipment, telecommunications equipment, av machine, home appliance and measuring instrument). the application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except oa equipment, telecommunications equipment, av machine , home appliance and measuring instrument. 5) in order to export the products or technologies described in this data sheet which are under the foreign exchange and foreign trade control law, it is necessary to first obtain an export permit from the japanese government. 6) no part of this data sheet may be reprinted or reproduced without prior written permission from stanley electric co., ltd. 7) the most updated edition of this data sheet can be obtained from the address below: http:// www.stanley - components.com/en page : 21 2017/10/9

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