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For wedge Found Datasheets File :: 964 Search Time::1.843ms
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				Hittite Microwave Corporation
Part No.	HMC566 HMC565
OCR Text	...edule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C and a ball bonding force of 40 to 50 grams or wedge bonding force of ...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 29 - 36 GHz GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 6 - 20 GHz
File Size	287.26K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC590 HMC59009
OCR Text	... schedule. wire bonding ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. thermosonic wirebonding with a nominal stage temperature of 150 c and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams...
Description	GaAs PHEMT MMIC 1 WATT POWER AMPLIFIER, 6 - 10 GHz
File Size	287.05K / 8 Page	View it Online	Download Datasheet

				http:// LEDTRONICS[LEDTRONICS, INC] LEDtronics, Inc.
Part No.	5SB206CR6-28V-BP 5SB206CY3K-48V-BP 5SB200CIW2K-28V 5SB200CIW2K-28V-AC 5SB200CIW2K-28V-B 5SB200CIW2K-28V-BP 5SB200CIW2K-36V 5SB200CIW2K-36V-AC 5SB200CIW2K-36V-B 5SB200CIW2K-36V-BP 5SB200CIW2K-48V 5SB200CIW2K-48V-AC 5SB200CIW2K-48V-B 5SB200CIW2K-48V-BP 5SB200CO3K-28V 5SB200CO3K-28V-AC 5SB200CO3K-28V-B 5SB200CO3K-28V-BP 5SB200CO3K-36V 5SB200CO3K-36V-AC 5SB200CO3K-36V-B 5SB200CO3K-36V-BP 5SB200CO3K-48V 5SB200CO3K-48V-AC 5SB200CO3K-48V-B 5SB200CO3K-48V-BP 5SB200CR6-28V 5SB200CR6-28V-AC 5SB200CR6-28V-B 5SB200CR6-28V-BP 5SB200CR6-36V 5SB200CR6-36V-B 5SB200CR6-36V-BP 5SB200CR6-48V 5SB200CR6-48V-AC 5SB200CR6-48V-B 5SB200CR6-48V-BP 5SB200CR7-28V 5SB200CR7-28V-AC 5SB200CR7-28V-B 5SB200CR7-28V-BP 5SB200CR7-36V 5SB200CR7-36V-AC 5SB200CR7-36V-B 5SB200CR7-36V-BP 5SB200CR7-48V 5SB200CR7-48V-AC 5SB200CR7-48V-B 5SB200CR7-48V-BP 5SB200CY3K-28V 5SB200CY3K-28V-AC 5SB200CY3K-28V-B 5SB200CY3K-28V-BP 5SB200CY3K-36V 5SB200CY3K-36V-AC 5SB200CY3K-36V-B 5SB200CY3K-36V-BP 5SB200CY3K-48V 5SB200CY3K-48V-AC 5SB200CY3K-48V-B 5SB200CY3K-48V-BP 5SB206CIW2K-28V 5SB206CIW2K-28V-AC 5SB206CIW2K-28V-B 5SB206CIW2K-28V-BP 5SB206CIW2K-36V 5SB206CIW2K-36V-AC 5SB206CIW2K-36V-B 5SB206CIW2K-36V-BP 5SB206CIW2K-48V 5SB206CIW2K-48
OCR Text	...5 Teleslide = Bi-Pin Dome LED = wedge = Wire Terminal = Cartridge 2 Pin Cylindrical Lens CD = Cartridge 2 Pin Dome Lens Series 28V LED/Chip Brightness Code (Examples) 6-chip LEDs R6 = HE Red (635nm) R7 = UL Red (660nm) Y3K = SP Yel (595...
Description	Double Contact Type Miniature BaseLED Lamps
File Size	117.36K / 1 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation Hittite Microwave Corpo...
Part No.	HMC55509
OCR Text	... schedule. wire bonding ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. thermosonic wirebonding with a nominal stage temperature of 150 c and a ball bonding force of 40 to 50 grams or wedge bonding force of...
Description	GaAs MMIC I/Q MIXER 31 - 38 GHz
File Size	242.81K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC591
OCR Text	... schedule. wire bonding ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. thermosonic wirebonding with a nominal stage temperature of 150 deg. c and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 ...
Description	GaAs PHEMT MMIC 2-Watt Power Amplifier
File Size	423.17K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corpo... Hittite Microwave Corporation 美国讯泰微波有限公司上海代表
Part No.	HMC322
OCR Text	...edule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 deg. C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 gr...
Description	GaAs MMIC SP8T NON-REFLECTIVE SWITCH, DC - 10.0 GHz GaAs MMIC SP8T NON-REFLECTIVE SWITCH/ DC - 10.0 GHz
File Size	175.07K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC591 HMC59109
OCR Text	... schedule. wire bonding ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. thermosonic wirebonding with a nominal stage temperature of 150 c and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams...
Description	GaAs PHEMT MMIC 2 WATT POWER AMPLIFIER, 6 - 10 GHz
File Size	296.07K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC129
OCR Text	...edule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams ...
Description	GaAs MMIC DOUBLE-BALANCED MIXER, 4 - 8 GHz
File Size	171.18K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC247
OCR Text	...edule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 deg. C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 gr...
Description	400° ANALOG PHASE SHIFTER 5 - 18 GHz
File Size	308.29K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC49009
OCR Text	... schedule. wire bonding ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. thermosonic wirebonding with a nominal stage temperature of 150 c and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams...
Description	GaAs PHEMT MMIC LOW NOISE HIGH IP3 AMPLIFIER, 12 - 17 GHz
File Size	266.75K / 6 Page	View it Online	Download Datasheet

For wedge Found Datasheets File :: 964 Search Time::1.843ms
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