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  wedge Datasheet PDF File

For wedge Found Datasheets File :: 956    Search Time::0.859ms    
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    586-1201-201F 586-1201-202F 586-1201-203F 586-1201-204F 586-1201-205F 586-1202-203F 586-1202-204F 586-1202-205F 586-1203

Dialight Corporation
Dialight PLC
Part No. 586-1201-201F 586-1201-202F 586-1201-203F 586-1201-204F 586-1201-205F 586-1202-203F 586-1202-204F 586-1202-205F 586-1203-201F 586-1203-202F 586-1203-203F 586-1203-204F 586-1203-205F 586-1205-201F 586-1205-202F 586-1206-203F 586-1202-202F 586-1205-205F 586-1206-201F 586-1206-202F 586-1202-201F 586-1205-203F 586-1205-204F 586-1206-204F 586-1206-205F
OCR Text ...on. 586 series based led t1 3/4 wedge (t5) specifications measurements are typical dimensions are inches [mm] operating voltages: 6, 12, 14, 24, and 28 vdc non-polarized operating temperature: -30 o c to + 85 o c storage temper...
Description BASED LED T1 3/4 wedge (T5)
T-1 3/4 SINGLE COLOR LED, GREEN, 5.89 mm ROHS COMPLIANT PACKAGE-2
T-1 3/4 SINGLE COLOR LED, WHITE, 5.89 mm

File Size 115.07K  /  2 Page

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    MA01502D1

Tyco Electronics
Part No. MA01502D1
OCR Text ...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply ne...
Description X-Band Limiter/Low Noise Amplifier 8.5 -12.0 GHz

File Size 315.29K  /  6 Page

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    SNA-100

STANFORD[Stanford Microdevices]
Part No. SNA-100
OCR Text ...tanford Microdevices recommends wedge bonding or ball bonding to the pads of these devices. Recommended wedge Bonding Procedure Assembly Techniques Epoxy die attach is recommended. The top and bottom metallization is gold. Conductive si...
Description 的DC - 10 GHz的砷化镓MMIC放大器级
DC-10 GHz, Cascadable GaAs MMIC Amplifier

File Size 61.54K  /  3 Page

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    MACOM[Tyco Electronics]
Part No. MAAP-008509-MCH000 MAAP-008509-SMB004 MA08509D_1 MAAP-008509-PED000 MA08509D1
OCR Text ...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply ne...
Description Amplifier, Power, 10W 8.5-10.5 GHz

File Size 204.40K  /  5 Page

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    MAPCGM0005-DIE

Tyco Electronics
Part No. MAPCGM0005-DIE
OCR Text ...ard ball or thermal compression wedge bond techniques. For DC and RF pad connections, use either ball or wedge bonds. For best performance, especially above 10 GHz, wedge bonds of shortest length employed on the RF interconnects is preferre...
Description 6-Bit Digital Phase Shifter 7.0-12.0 GHz

File Size 305.97K  /  7 Page

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    TQM6M9085

TriQuint Semiconductor
Part No. TQM6M9085
OCR Text ... 1 - quantum tx? linear wedge 5.25x6mm sp8t transmit module tqm6m9085 11 absolute maximum ratings parameter symbol min max unit ...
Description QUANTUM Tx Linear wedge 5.25x6mm SP8T Transmit Module

File Size 196.79K  /  1 Page

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    TQM7M5013

TriQuint Semiconductor
Part No. TQM7M5013
OCR Text ... applications ? gsm/edge/wedge handsets ? gsm/edge/wedge wireless cards package style c ontrol c ircuit rf_in_dcs vbatt hben vmode0 vmode1 lben gnd rf_in_gsm rf_out_dcs vcc rf_out_gsm product desc...
Description Quad-Band GSM / GPRS / EDGE-Linear Power Amplifier Module

File Size 181.85K  /  1 Page

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    SNA-200

http://
Stanford Microdevices
Part No. SNA-200
OCR Text ...tanford Microdevices recommends wedge bonding or ball bonding to the pads of these devices. Recommended wedge Bonding Procedure Assembly Techniques Epoxy die attach is recommended. The top and bottom metallization is gold. Conductive si...
Description DC-6.5 GHz, Cascadable GaAs MMIC Amplifier

File Size 63.78K  /  3 Page

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    MAAPGM0030-DIE

Tyco Electronics
Part No. MAAPGM0030-DIE
OCR Text ...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply ne...
Description 5.0-9.0 GHz 1W Power Amplifier

File Size 265.69K  /  6 Page

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    586-2202-201F 586-2202-202F 586-2202-203F 586-2202-204F 586-2201-204F 586-2201-201F 586-2201-203F 586-2201-202F 586-2203

Dialight Corporation
Dialight PLC
Part No. 586-2202-201F 586-2202-202F 586-2202-203F 586-2202-204F 586-2201-204F 586-2201-201F 586-2201-203F 586-2201-202F 586-2203-202F 586-2203-203F 586-2203-204F 586-2205-201F 586-2205-202F 586-2205-203F 586-2205-204F 586-2206-201F 586-2206-202F 586-2206-203F 586-2206-204F 586-220A-202F 586-220A-203F 586-220A-204F 586-220B-202F 586-220B-203F 586-220B-204F 586-2203-201F
OCR Text ...on. 586 series based led t3 1/4 wedge (t10) specifications measurements are typical dimensions are inches [mm] operating voltages: 6,12,14 and 24 vdc non-polarized operating temperature: -30 o c to + 85 o c storage temperatur...
Description 586 Series BASED LED T3 1/4 wedge (T10)
T-3 1/4 SINGLE COLOR LED, YELLOW

File Size 101.68K  /  2 Page

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For wedge Found Datasheets File :: 956    Search Time::0.859ms    
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