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  08U0 Datasheet PDF File

For 08U0 Found Datasheets File :: 113+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 |   

    Samsung
Part No. K9F4G08U0D
Description 4Gb D-die NAND Flash

File Size 674.94K  /  42 Page

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Amphenol Communications Solutions

Part No. 10114508-U0J-40DLF
Description XCede® High Speed Backplane Connectors, Right polarized guide header module with key.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K9F6408U0A-TCB0
Description TV 32C 32#20 SKT RECP 8米8位NAND闪存

File Size 350.56K  /  26 Page

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Amphenol Communications Solutions

Part No. 59202-F28-08U050
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 16 Positions.
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K9F5608U0M-YCB0 K9F5608U0M-YIB0
Description 32M x 8 Bit NAND Flash Memory

File Size 355.87K  /  26 Page

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Amphenol Communications Solutions

Part No. 10114508-U0J-10DLF
Description XCede® High Speed Backplane Connectors, Right polarized guide header module with key.
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K9F2808U0M-YIB0 K9F2808U0M-YCB0
Description 16M x 8 Bit NAND Flash Memory 1,600 × 8位NAND闪存

File Size 349.99K  /  26 Page

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Amphenol Communications Solutions

Part No. 10114508-U0J-20DLF
Description XCede® High Speed Backplane Connectors, Right polarized guide header module with key.
Tech specs    

Official Product Page

    Samsung Electronics Inc
Part No. K9F1208U0M-YIB0 K9F1208U0M-YCB0
Description EEPROM - Datasheet Reference
From old datasheet system

File Size 522.24K  /  40 Page

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Amphenol Communications Solutions

Part No. 59202-F28-08U050LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 16 Positions.
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K9F6408U0B-TIB0 K9F6408U0B-TCB0
Description 8M x 8 Bit NAND Flash Memory 8米8位NAND闪存

File Size 418.95K  /  27 Page

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Amphenol Communications Solutions

Part No. 59112-F24-08U035LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 16 Positions.
Tech specs    

Official Product Page

    Samsung Electronics Inc
Part No. K9F5608U0A-YIB0 K9F5608U0A-YCB0
Description EEPROM,NAND FLASH,33MX8,CMOS,TSSOP,48PIN,PLASTIC
From old datasheet system

File Size 260.49K  /  29 Page

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Amphenol Communications Solutions

Part No. 10114508-U0J-30DLF
Description XCede® High Speed Backplane Connectors, Right polarized guide header module with key.
Tech specs    

Official Product Page

    Samsung Electronic
Part No. K9K1208U0A-VCIB0
Description 64M x 8 Bit NAND Flash Memory Data Sheet

File Size 354.44K  /  27 Page

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K9F2808U0A-YCB0 K9F2808U0A-YIB0
Description Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVPS00; No. of Contacts:11; Connector Shell Size:21; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Body Style:Straight
TV 79C 79#22D PIN RECP

File Size 356.97K  /  26 Page

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K9F5608U0A-YCB0 K9F5608U0A-YIB0
Description TV 16C 16#16 PIN RECP
TV 79C 79#22D PIN RECP

File Size 613.64K  /  29 Page

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For 08U0 Found Datasheets File :: 113+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 |   

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