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  08U0 Datasheet PDF File

For 08U0 Found Datasheets File :: 113+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 |   

    SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K9K1208U0M-YIB0 K9K1208U0M-YCB0
Description 64M x 8 Bit NAND Flash Memory 6400 × 8位NAND闪存

File Size 357.11K  /  26 Page

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Amphenol Communications Solutions

Part No. 10114508-U0J-40DLF
Description XCede® High Speed Backplane Connectors, Right polarized guide header module with key.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K9F6408U0M-TCB0 K9F6408U0M-TIB0
Description 8M x 8 Bit NAND Flash Memory

File Size 483.65K  /  26 Page

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Amphenol Communications Solutions

Part No. 59202-F28-08U050
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 16 Positions.
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K9K1G08U0M-YIB0 K9K1G08U0M-YCB0
Description 128M x 8 Bit NAND Flash Memory

File Size 477.43K  /  37 Page

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Amphenol Communications Solutions

Part No. 10114508-U0J-10DLF
Description XCede® High Speed Backplane Connectors, Right polarized guide header module with key.
Tech specs    

Official Product Page

    K9F6408U0M-TCB0 K9F6408U0M-TIB0

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K9F6408U0M-TCB0 K9F6408U0M-TIB0
Description 8M x 8 Bit NAND Flash Memory

File Size 477.87K  /  26 Page

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Amphenol Communications Solutions

Part No. 10114508-U0J-20DLF
Description XCede® High Speed Backplane Connectors, Right polarized guide header module with key.
Tech specs    

Official Product Page

    K9F5608U0 K9F5608U0A K9F5608U0A-YCB0 K9F5608U0A-YIB0

Samsung Electronic
Samsung semiconductor
Part No. K9F5608U0 K9F5608U0A K9F5608U0A-YCB0 K9F5608U0A-YIB0
Description 32M x 8 Bit NAND Flash Memory

File Size 607.24K  /  29 Page

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Amphenol Communications Solutions

Part No. 59202-F28-08U050LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 16 Positions.
Tech specs    

Official Product Page

    K9F5608U0M- K9F5608U0M-YCB0 K9F5608U0M-YIB0

Samsung Electronics Inc
SAMSUNG[Samsung semiconductor]
Part No. K9F5608U0M- K9F5608U0M-YCB0 K9F5608U0M-YIB0
Description From old datasheet system
EEPROM,NAND FLASH,33MX8,CMOS,TSSOP,48PIN,PLASTIC
32M x 8 Bit NAND Flash Memory

File Size 350.10K  /  26 Page

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Amphenol Communications Solutions

Part No. 59112-F24-08U035LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 16 Positions.
Tech specs    

Official Product Page

    K9F2808U0 K9F2808U0A K9F2808U0A- K9F2808U0A-YCB0 K9F2808U0A-YIB0

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K9F2808U0 K9F2808U0A K9F2808U0A- K9F2808U0A-YCB0 K9F2808U0A-YIB0
Description 16M x 8 Bit NAND Flash Memory

File Size 351.20K  /  26 Page

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Amphenol Communications Solutions

Part No. 10114508-U0J-30DLF
Description XCede® High Speed Backplane Connectors, Right polarized guide header module with key.
Tech specs    

Official Product Page

    K9F2808U0M- K9F2808U0M-YCB0 K9F2808U0M-YIB0

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K9F2808U0M- K9F2808U0M-YCB0 K9F2808U0M-YIB0
Description 16M x 8 Bit NAND Flash Memory

File Size 344.24K  /  26 Page

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    K9F6408U0A-TCB0 K9F6408U0A-TIB0

SAMSUNG[Samsung semiconductor]
Samsung Electronics Inc
Part No. K9F6408U0A-TCB0 K9F6408U0A-TIB0
Description From old datasheet system
EEPROM,NAND FLASH,8MX8,CMOS,TSOP,44PIN,PLASTIC
8M x 8 Bit NAND Flash Memory

File Size 344.78K  /  26 Page

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    K9K1G08U0M-YCB0 K9K1G08U0M-YIB0

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K9K1G08U0M-YCB0 K9K1G08U0M-YIB0
Description 128M x 8 Bit NAND Flash Memory

File Size 465.75K  /  37 Page

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For 08U0 Found Datasheets File :: 113+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 |   

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