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  08U0 Datasheet PDF File

For 08U0 Found Datasheets File :: 113+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 |   

    K9F6408U0B K9F6408U0B-TCB0 K9F6408U0B-TIB0

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K9F6408U0B K9F6408U0B-TCB0 K9F6408U0B-TIB0
Description 8M x 8 Bit NAND Flash Memory

File Size 412.99K  /  27 Page

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Amphenol Communications Solutions

Part No. 10114508-U0J-40DLF
Description XCede® High Speed Backplane Connectors, Right polarized guide header module with key.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    K9F4G08U0D-SIB0000

Samsung semiconductor
Part No. K9F4G08U0D-SIB0000
Description Product Selection Guide Samsung Semiconductor, Inc. Memory & Storage

File Size 746.06K  /  28 Page

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Amphenol Communications Solutions

Part No. 59202-F28-08U050
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 16 Positions.
Tech specs    

Official Product Page

    K9K8G08U0B-PIB0000

Samsung semiconductor
Part No. K9K8G08U0B-PIB0000
Description 1G x 8 / 2G x 8 Bit NAND Flash Memory

File Size 1,036.01K  /  48 Page

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Amphenol Communications Solutions

Part No. 10114508-U0J-10DLF
Description XCede® High Speed Backplane Connectors, Right polarized guide header module with key.
Tech specs    

Official Product Page

    K9F1G08U0C-PCB0T00

Samsung semiconductor
Part No. K9F1G08U0C-PCB0T00
Description Samsung Semiconductor, Inc. Product Selection Guide

File Size 927.99K  /  36 Page

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Amphenol Communications Solutions

Part No. 10114508-U0J-20DLF
Description XCede® High Speed Backplane Connectors, Right polarized guide header module with key.
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K9F6408Q0C-B K9F6408U0C-B K9F6408U0C-Q
Description Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVP00; No. of Contacts:56; Connector Shell Size:25; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Body Style:Straight
8M x 8 Bit Bit NAND Flash Memory

File Size 502.29K  /  29 Page

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Amphenol Communications Solutions

Part No. 59202-F28-08U050LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 16 Positions.
Tech specs    

Official Product Page

    K9F6408Q0C K9F6408Q0C-B K9F6408Q0C-H K9F6408U0C-B K9F6408U0C-F K9F6408U0C-H K9F6408U0C-Q K9F6408U0C-T K9F6408U0C-V

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K9F6408Q0C K9F6408Q0C-B K9F6408Q0C-H K9F6408U0C-B K9F6408U0C-F K9F6408U0C-H K9F6408U0C-Q K9F6408U0C-T K9F6408U0C-V
Description 8M x 8 Bit Bit NAND Flash Memory

File Size 495.88K  /  29 Page

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Amphenol Communications Solutions

Part No. 59112-F24-08U035LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 16 Positions.
Tech specs    

Official Product Page

    Samsung Electronics
Part No. K9F2G08U0B K9F2G08B0B
Description FLASH MEMORY

File Size 861.74K  /  41 Page

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Amphenol Communications Solutions

Part No. 10114508-U0J-30DLF
Description XCede® High Speed Backplane Connectors, Right polarized guide header module with key.
Tech specs    

Official Product Page

    Samsung Electronics
Part No. K9F2G08U0A K9F2G08R0A
Description (K9F2G08UxA) Flash Memory

File Size 1,140.50K  /  49 Page

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    Samsung Electronics
Part No. K9F8G08B0M K9F8G08U0M
Description FLASH MEMORY

File Size 1,241.38K  /  54 Page

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    DSK9F1208U0M K9F1208U0 K9F1208U0M- K9F1208U0M-YCB0 K9F1208U0M-YIB0 DS_K9F1208U0M

SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. DSK9F1208U0M K9F1208U0 K9F1208U0M- K9F1208U0M-YCB0 K9F1208U0M-YIB0 DS_K9F1208U0M
Description 64M x 8 Bit NAND Flash Memory

File Size 1,135.14K  /  41 Page

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For 08U0 Found Datasheets File :: 113+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 |   

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