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  126H Datasheet PDF File

For 126H Found Datasheets File :: 111+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 |   

    SEMIX703GB126HD SEMIX703GB126HD07

Semikron International
Part No. SEMIX703GB126HD SEMIX703GB126HD07
Description Trench IGBT Modules 700 A, 1200 V, N-CHANNEL IGBT

File Size 1,005.34K  /  5 Page

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Amphenol Communications Solutions

Part No. 68488-126HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch, Right Angle, 5.84 mm (0.23 in.) Mating, 4.57 mm (0.18 in.) Tail
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    SEMIX503GB126HD SEMIX503GB126HD06

Semikron International
Part No. SEMIX503GB126HD SEMIX503GB126HD06
Description Trench IGBT Modules

File Size 941.89K  /  4 Page

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Amphenol Communications Solutions

Part No. 94611-126HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 26 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SEMIX503GB126HD07

Semikron International
Part No. SEMIX503GB126HD07
Description Trench IGBT Modules

File Size 995.72K  /  5 Page

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Amphenol Communications Solutions

Part No. 68001-126HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 26 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SEMIX151GD126HDS10

Semikron International
Part No. SEMIX151GD126HDS10
Description Trench IGBT Modules

File Size 147.20K  /  5 Page

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Amphenol Communications Solutions

Part No. 68498-126HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch, Right Angle, 5.84 mm (0.23 in.) Mating, 5.59 mm (0.22 in.) Tail
Tech specs    

Official Product Page

    SEMIX353GD126HDC07

Semikron International
Part No. SEMIX353GD126HDC07
Description Trench IGBT Modules

File Size 949.91K  /  5 Page

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Amphenol Communications Solutions

Part No. 67997-126HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 26 Positions, 2.54 mm (0.100in) Pitch
Tech specs    

Official Product Page

    SEMIX353GD126HDC09

Semikron International
Part No. SEMIX353GD126HDC09
Description Trench IGBT Modules

File Size 154.33K  /  5 Page

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Amphenol Communications Solutions

Part No. 68002-126HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 26 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SEMIX703GB126HDS09

Semikron International
Part No. SEMIX703GB126HDS09
Description Trench IGBT Modules

File Size 158.46K  /  6 Page

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Amphenol Communications Solutions

Part No. 78290-126HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

    SEMIX251GD126HDS07

Semikron International
Part No. SEMIX251GD126HDS07
Description Trench IGBT Modules

File Size 1,018.69K  /  5 Page

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    SEMIX252GB126HDS08

Semikron International
Part No. SEMIX252GB126HDS08
Description Trench IGBT Modules

File Size 135.14K  /  5 Page

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    SEMIX101GD126HDS10

Semikron International
Part No. SEMIX101GD126HDS10
Description Trench IGBT Modules

File Size 145.53K  /  5 Page

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Part: 12604-23
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