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  126H Datasheet PDF File

For 126H Found Datasheets File :: 111+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 |   

    SEMIX251GD126HDS06

Semikron International
Part No. SEMIX251GD126HDS06
Description Trench IGBT Modules

File Size 1,088.12K  /  4 Page

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Amphenol Communications Solutions

Part No. 68488-126HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch, Right Angle, 5.84 mm (0.23 in.) Mating, 4.57 mm (0.18 in.) Tail
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    SEMIX251GD126HDS10

Semikron International
Part No. SEMIX251GD126HDS10
Description Trench IGBT Modules

File Size 150.08K  /  5 Page

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Amphenol Communications Solutions

Part No. 94611-126HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 26 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SEMIX503GD126HDC07

Semikron International
Part No. SEMIX503GD126HDC07
Description Trench IGBT Modules

File Size 969.81K  /  5 Page

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Amphenol Communications Solutions

Part No. 68001-126HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 26 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SEMIX703GB126HDS10

Semikron International
Part No. SEMIX703GB126HDS10
Description Trench IGBT Modules

File Size 150.34K  /  5 Page

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Amphenol Communications Solutions

Part No. 68498-126HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch, Right Angle, 5.84 mm (0.23 in.) Mating, 5.59 mm (0.22 in.) Tail
Tech specs    

Official Product Page

    SEMIX604GB126HDS10

Semikron International
Part No. SEMIX604GB126HDS10
Description Trench IGBT Modules

File Size 147.10K  /  5 Page

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Amphenol Communications Solutions

Part No. 67997-126HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 26 Positions, 2.54 mm (0.100in) Pitch
Tech specs    

Official Product Page

    SEMIX703GD126HDC SEMIX703GD126HDC06

Semikron International
Part No. SEMIX703GD126HDC SEMIX703GD126HDC06
Description Trench IGBT Modules

File Size 1,039.80K  /  4 Page

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Amphenol Communications Solutions

Part No. 68002-126HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 26 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SEMIX503GD126HDC SEMIX503GD126HDC06

Semikron International
Part No. SEMIX503GD126HDC SEMIX503GD126HDC06
Description Trench IGBT Modules

File Size 1,071.69K  /  4 Page

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Amphenol Communications Solutions

Part No. 78290-126HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

    SEMIX503GB126HDS07

Semikron International
Part No. SEMIX503GB126HDS07
Description Trench IGBT Modules

File Size 1,080.86K  /  5 Page

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    SEMIX503GD126HDC10

Semikron International
Part No. SEMIX503GD126HDC10
Description Trench IGBT Modules

File Size 146.15K  /  5 Page

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    SEMIX503GB126HDS SEMIX503GB126HDS06

Semikron International
Part No. SEMIX503GB126HDS SEMIX503GB126HDS06
Description Trench IGBT Modules

File Size 1,079.50K  /  4 Page

View it Online

Download Datasheet

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