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  126H Datasheet PDF File

For 126H Found Datasheets File :: 111+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 |   

    SEMIX151GD126HDS07

Semikron International
Part No. SEMIX151GD126HDS07
Description Trench IGBT Modules

File Size 996.21K  /  5 Page

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Amphenol Communications Solutions

Part No. 68488-126HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch, Right Angle, 5.84 mm (0.23 in.) Mating, 4.57 mm (0.18 in.) Tail
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    SEMIX151GD126HDS06 SEMIX151GD126HDS

Semikron International
Part No. SEMIX151GD126HDS06 SEMIX151GD126HDS
Description Trench IGBT Modules

File Size 1,046.51K  /  4 Page

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Amphenol Communications Solutions

Part No. 94611-126HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 26 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SEMIX101GD126HDS07

Semikron International
Part No. SEMIX101GD126HDS07
Description Trench IGBT Modules

File Size 965.14K  /  5 Page

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Amphenol Communications Solutions

Part No. 68001-126HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 26 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SEMIX101GD126HDS06 SEMIX101GD126HDS

http://
Semikron International
Part No. SEMIX101GD126HDS06 SEMIX101GD126HDS
Description Trench IGBT Modules

File Size 1,022.81K  /  4 Page

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Amphenol Communications Solutions

Part No. 68498-126HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch, Right Angle, 5.84 mm (0.23 in.) Mating, 5.59 mm (0.22 in.) Tail
Tech specs    

Official Product Page

    SEMIX353GB126HDS09

Semikron International
Part No. SEMIX353GB126HDS09
Description Trench IGBT Modules

File Size 155.79K  /  6 Page

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Amphenol Communications Solutions

Part No. 67997-126HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 26 Positions, 2.54 mm (0.100in) Pitch
Tech specs    

Official Product Page

    SEMIX703GD126HDC07

Semikron International
Part No. SEMIX703GD126HDC07
Description Trench IGBT Modules

File Size 979.45K  /  5 Page

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Amphenol Communications Solutions

Part No. 68002-126HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 26 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SEMIX703GB126HDS07

Semikron International
Part No. SEMIX703GB126HDS07
Description Trench IGBT Modules

File Size 1,150.75K  /  5 Page

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Amphenol Communications Solutions

Part No. 78290-126HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

    SEMIX302GB126HDS07

Semikron International
Part No. SEMIX302GB126HDS07
Description Trench IGBT Modules

File Size 1,025.33K  /  5 Page

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    SEMIX604GB126HDS06

Semikron International
Part No. SEMIX604GB126HDS06
Description Trench IGBT Modules

File Size 1,308.26K  /  4 Page

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    SEMIX604GB126HDS07

Semikron International
Part No. SEMIX604GB126HDS07
Description Trench IGBT Modules

File Size 1,090.21K  /  5 Page

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