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Texas Instruments |
| Part No. |
PTMAG3001A1YBGR
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| Description |
Three-axis linear Hall-effect sensor with I<sup>2</sup>C and programmable switch in wafer chip-scale package 6-DSBGA -40 to 125
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| Tech specs |
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Official Product Page
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Texas Instruments |
| Part No. |
PTMAG3001A2YBGR
|
| Description |
Three-axis linear Hall-effect sensor with I<sup>2</sup>C and programmable switch in wafer chip-scale package 6-DSBGA -40 to 125
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
59202-G30-08-052
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| Description |
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 16 Positions.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
59112-G30-06-066LF
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| Description |
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 12 Positions.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54101-G3001LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 1 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
59132-G30-02-064LF
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| Description |
Minitek® 2.00mm, Board to Board Connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 4 Positions, 2.00mm (0.079in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54202-G3009PLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54202-G3007ALF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 14 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54202-G3009LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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STMicroelectronics N.V.
Wi2Wi, Inc.
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| Part No. |
RIVA128ZX STG3005A2S
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| Description |
128-BIT 3D MULTIMEDIA ACCELERATOR 128D多媒体加速器
128-Bit 3D Multimedia Accelerator(128D多媒体加速器) 128D多媒体加速器28位三维多媒体加速器
128-BIT 3D MULTIMEDIA ACCELERATOR 1283D多媒体加速器
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| File Size |
621.23K /
85 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
54202-G3005LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 10 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
| Part: G30N60B3D |
| Maker: 哈里斯 |
| Pack: TO-3P |
| Stock: Reserved |
| Unit price
for : |
|
50: $2.83 |
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100: $2.69 |
| 1000:
$2.55 |
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Email: oulindz@gmail.com |
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Contact us |
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