| |
|
 |
Texas Instruments |
| Part No. |
PTMAG3001A1YBGR
|
| Description |
Three-axis linear Hall-effect sensor with I<sup>2</sup>C and programmable switch in wafer chip-scale package 6-DSBGA -40 to 125
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Texas Instruments |
| Part No. |
PTMAG3001A2YBGR
|
| Description |
Three-axis linear Hall-effect sensor with I<sup>2</sup>C and programmable switch in wafer chip-scale package 6-DSBGA -40 to 125
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
59202-G30-08-052
|
| Description |
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 16 Positions.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
59112-G30-06-066LF
|
| Description |
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 12 Positions.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
54101-G3001LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 1 Positions, 2.54 mm Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
59132-G30-02-064LF
|
| Description |
Minitek® 2.00mm, Board to Board Connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 4 Positions, 2.00mm (0.079in) Pitch
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
54202-G3009PLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
54202-G3007ALF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 14 Positions, 2.54 mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
54202-G3009LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
FAIRCHILD[Fairchild Semiconductor]
Fairchild Semiconductor Corporation
|
| Part No. |
FM2G300US60
|
| Description |
IGBT
Molding Type Module
Sweep Function Generator; Bandwidth Max:12MHz; Frequency Max:12MHz; Frequency Min:0.1Hz; Waveforms:Sine, Square, Triangle, Ramp, Pulse RoHS Compliant: NA
|
| File Size |
694.15K /
9 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
54202-G3005LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 10 Positions, 2.54 mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
|
Bom2Buy.com
Price and Availability
|
|
|
JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
| Part: G30N60B3D |
| Maker: 哈里斯 |
| Pack: TO-3P |
| Stock: Reserved |
| Unit price
for : |
|
50: $2.83 |
|
100: $2.69 |
| 1000:
$2.55 |
|
Email: oulindz@gmail.com |
|
Contact us |
|
|
