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  G300 Datasheet PDF File

For G300 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    SGS Thomson Microelectronics
ST Microelectronics
Part No. RIVA128ZX-STG3005A2S RIVA-128ZX
Description 128-BIT 3D MULTIMEDIA ACCELERATOR
128-BIT 3D MULTIMEDIA ACCELERATOR

File Size 608.49K  /  85 Page

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Texas Instruments

Part No. PTMAG3001A1YBGR
Description Three-axis linear Hall-effect sensor with I<sup>2</sup>C and programmable switch in wafer chip-scale package 6-DSBGA -40 to 125
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Powerex Power Semicondu...
Part No. MIG300Q2CMB1X
Description Compact IPM Series

File Size 217.41K  /  6 Page

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Texas Instruments

Part No. PTMAG3001A2YBGR
Description Three-axis linear Hall-effect sensor with I<sup>2</sup>C and programmable switch in wafer chip-scale package 6-DSBGA -40 to 125
Tech specs    

Official Product Page

    Powerex Power Semicondu...
Part No. MIG300J2CSB1W
Description Compact IPM Series

File Size 223.40K  /  6 Page

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Amphenol Communications Solutions

Part No. 59202-G30-08-052
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 16 Positions.
Tech specs    

Official Product Page

    TOSHIBA
Part No. MIG300J2CSB1W
Description Intelligent Power Module Silicon N Channel IGBT High Power Switching Applications Motor Control Applications

File Size 163.04K  /  10 Page

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Amphenol Communications Solutions

Part No. 59112-G30-06-066LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 12 Positions.
Tech specs    

Official Product Page

    Taiyo Yuden (U.S.A.), I...
Part No. UMK063CG300JT-F
Description    Standard Multilayer Ceramic Capacitors (Temperature compensating type)

File Size 282.84K  /  2 Page

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Amphenol Communications Solutions

Part No. 54101-G3001LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 1 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    BLM21PG300SN1

Silicon Laboratories
Part No. BLM21PG300SN1
Description    NON-ISOLATED EVALUATION BOARD FOR THE Si3402B

File Size 452.23K  /  13 Page

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Amphenol Communications Solutions

Part No. 59132-G30-02-064LF
Description Minitek® 2.00mm, Board to Board Connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 4 Positions, 2.00mm (0.079in) Pitch
Tech specs    

Official Product Page

    FAIRCHILD[Fairchild Semiconductor]
Fairchild Semiconductor Corporation
Part No. FMBL1G300US60
Description IGBT
Molding Type Module
BK Precision Sweep/Function Generators, Waveforms: Sine, Square, Triangle, /- Pulse, /- Ramp, Frequency Range: .2 Hz-20 MHz, Resolution: 5 Digits, Tuning Range: 10:1, Impedance: 50 Ohm, Attenuation: -20 /-1 dB

File Size 691.70K  /  9 Page

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Amphenol Communications Solutions

Part No. 54202-G3009PLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    FMG1G300US60H

Fairchild Semiconductor
Part No. FMG1G300US60H
Description 600V, 300A IGBT Module (Molding Type)

File Size 491.78K  /  7 Page

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Amphenol Communications Solutions

Part No. 54202-G3007ALF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 14 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    FMG1G300US60L

Fairchild Semiconductor
Part No. FMG1G300US60L
Description 600V, 300A IGBT Module (Molding Type)

File Size 492.02K  /  7 Page

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Amphenol Communications Solutions

Part No. 54202-G3009LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    MIG300Q2CMB1X

TOSHIBA[Toshiba Semiconductor]
Toshiba Corporation
Part No. MIG300Q2CMB1X
Description Intelligent Power Module Silicon N Channel IGBT High Power Switching Applications Motor Control Applications
From old datasheet system

File Size 170.71K  /  10 Page

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Amphenol Communications Solutions

Part No. 54202-G3005LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 10 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

For G300 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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